One of the key points to answer your question is thermal stress.
When you apply heat to one pin of a device, there is a sudden and huge temperature difference between that point and the rest of the device. That difference is stress, and the result can be a material breakout.
In an oven, on the other hand, all the board is put under a controlled, gradual thermal rise. ALL the points of the device are at almost the same temperature, so there are no thermal stresses (or they are much smaller than) they were when you applied the soldering tool to ONE pin and the rest of the device is at room temperature.
Read More: SMT PCB Assembly
#PCB Assembly #PCB Materials
Impedance matching has become a cornerstone of the signal integrity in the realm of high speed PCB…
It is important to learn how to clean a circuit board properly if you’re working…
When designing PCBs, selecting the appropriate type of holes for fasteners is crucial. And much…
PCB copper foil is one of the most critical materials in the printed circuit board…
Shenzhen, China - February 11, 2025 - MOKO Technology, a leading global electronics manufacturing service…
While most people focus on the components and copper traces that make up PCBs, there's…