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Poke the tape with a rod from the back (which loosens it but doesn’t remove it completely), and then use tape to remove it. The method is pretty quick and can remove several thousand per hour when using a jig.
Read More: SMT Assembly
#PCB manufacturing
Our brand was focused on common electronic product with single PCB. And this year, we plan to develop a smart range which may require multiple layer PCB. Want to know more about 2 layer PCB or 4 layer PCB.
In order to reduce the size of a PCB, I will probably have to use smaller SM components. I currently use mostly 0805 passives, and am thinking about going to 0402 or smaller. Apart from power dissipation considerations, any pitfalls I should be aware of when making the transition?
I am prototyping a PCB, using Chip Quik’s “SMDSWLF.031, a Sn96.5/ Ag3.0/ Cu0.5 solder with 2.2% no-clean flux. I find that the black spots appears frequently in larger pads on my board. I wonder if it is because I left the soldering iron more time heating the solder and that burnt the flux. What is that black residue? Is that a sign of a bad joint or maybe bad soldering technique?
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