Categories: PCB Assembly

How can we identify the BGA area of PCB?

BGA stands for Ball Grid Array. It is a style of component footprint. These footprints appear as a rectangular array of small circles – one where each “ball” of the component is attached.

There will generally be a rectangular outline around the array that corresponds to the edges of the component’s package, and probably also some silkscreen (written) information identifying the component.

Read More: BGA PCB Assembly

#PCB Assembly

Oliver Smith

Oliver is an experienced electronics engineer skilled in PCB design, analog circuits, embedded systems, and prototyping. His deep knowledge spans schematic capture, firmware coding, simulation, layout, testing, and troubleshooting. Oliver excels at taking projects from concept to mass production using his electrical design talents and mechanical aptitude.

Recent Posts

What Is a PCB Netlist? Everything You Need to Know Is Here

In the world of printed circuit board design and manufacturing, precision and accuracy are paramount.…

1 day ago

What Is Solder Wetting and How to Prevent Poor Wetting?

Soldering is a cornerstone technique in electronics assembly, it's used to connect electrical pieces and…

3 weeks ago

7 Critical Techniques to Improve PCB Thermal Management

Nowadays, electronic products are both compact and lightweight while performing a variety of functions. This…

4 weeks ago

What Is BGA on a PCB? A Complete Guide to Ball Grid Array Technology

As technology continues to advance in the electronics industry, packaging remains one of the key…

1 month ago

How to Create a PCB Drawing: A Step-by-Step Guide for Beginners

Bringing your electronic ideas to life begins with PCB drawing, which is the process of…

3 months ago

8 Leading PCB Design Software: A Comprehensive Comparison

Printed Circuit Board design is one of the most significant processes in electronics production. Deciding…

3 months ago