BGA stands for Ball Grid Array. It is a style of component footprint. These footprints appear as a rectangular array of small circles – one where each “ball” of the component is attached.
There will generally be a rectangular outline around the array that corresponds to the edges of the component’s package, and probably also some silkscreen (written) information identifying the component.
Read More: BGA PCB Assembly
#PCB Assembly
A lot of DIY video mentions about ground via. I am just very curious about its function and necessity.
I have some PCBs that were wave soldered but the vias still remain open, they are not filled nor plugged form what I can see. I do not see any solder on the annular rings of the vias either. How do they go about doing so?
I know that using leaded process for lead-free BGA chips is not acceptable, because the solder balls of the BGA will not melt and the joint will be unreliable. But now BGA chip is only available in lead-free balls. is it ok to solder leaded BGA chips with a lead-free (thus, higher temperature) process?
Markets
Resources
Contact Us
Copyright ©2024 MOKO Technology | Your Trusted EMS Partner 粤ICP备15085690号
