How can I pack PCBA mass product for long-distance transportation?

I purchased a batch of PCBA via FOB abroad, which means goods will have been totally mine since they are on board. So how can I pack them to avoid any possible damage on the way?
  • Cargo pallet
  • ESD cotton bag to avoid chip damage
  • Bubble wrap to buffer the board from accident press
  • Dry PCB before packing

Read More: Logistics

#PCB Assembly

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Oliver Smith

Oliver is an experienced electronics engineer skilled in PCB design, analog circuits, embedded systems, and prototyping. His deep knowledge spans schematic capture, firmware coding, simulation, layout, testing, and troubleshooting. Oliver excels at taking projects from concept to mass production using his electrical design talents and mechanical aptitude.
Picture of Oliver Smith

Oliver Smith

Oliver is an experienced electronics engineer skilled in PCB design, analog circuits, embedded systems, and prototyping. His deep knowledge spans schematic capture, firmware coding, simulation, layout, testing, and troubleshooting. Oliver excels at taking projects from concept to mass production using his electrical design talents and mechanical aptitude.

What Others Are Asking

Do you use SMT or THT for USB mini B connector?

This question is about the advisability of continuing to use a USB mini-B right angle surface mount connector in my pcb designs. On occasion we see one of these connectors peel back or delaminate off the pcb. Immediately the question is asked, why didn’t you use a through hole connector?

Is it OK to bend a VIA in a Flex PBC?

On a Flex Printed Circuit (FPC) made out of Kapton polyimide, will anything bad happen if I put a VIA in a part of the FPC that has to bend? VIA size: 0.2 mm hole diameter in 0.4 mm copper diameter. FPC bend radius: 0.7 mm. Kapton thickness: 0.2 mm. Copper weight: either 2 oz or 1 oz (I haven’t decided yet)

Can leaded BGA chips be reflow soldered with lead-free process?

I know that using leaded process for lead-free BGA chips is not acceptable, because the solder balls of the BGA will not melt and the joint will be unreliable. But now BGA chip is only available in lead-free balls. is it ok to solder leaded BGA chips with a lead-free (thus, higher temperature) process?

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