- Cargo pallet
- ESD cotton bag to avoid chip damage
- Bubble wrap to buffer the board from accident press
- Dry PCB before packing
Read More: Logistics
#PCB Assembly
Read More: Logistics
#PCB Assembly
This question is about the advisability of continuing to use a USB mini-B right angle surface mount connector in my pcb designs. On occasion we see one of these connectors peel back or delaminate off the pcb. Immediately the question is asked, why didn’t you use a through hole connector?
On a Flex Printed Circuit (FPC) made out of Kapton polyimide, will anything bad happen if I put a VIA in a part of the FPC that has to bend? VIA size: 0.2 mm hole diameter in 0.4 mm copper diameter. FPC bend radius: 0.7 mm. Kapton thickness: 0.2 mm. Copper weight: either 2 oz or 1 oz (I haven’t decided yet)
I know that using leaded process for lead-free BGA chips is not acceptable, because the solder balls of the BGA will not melt and the joint will be unreliable. But now BGA chip is only available in lead-free balls. is it ok to solder leaded BGA chips with a lead-free (thus, higher temperature) process?
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