Put a machined guard around the pulse oximeter to keep the surface from it at about 0.2-0.3 (if it is and SMD part soldering height tolerance is about 0.2mm) and then simply screw down the resulting assembly.
Otherwise use weak springs to push the p.o. against the case, need to know the allowed stress on the body for that.
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#PCB Assembly
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My PCB manufacturer just informed me that he is facing PCB warpage issue in my simple, single sided, copper poured PCB. He says to avoid this issue he suggests to add a dummy copper patch by keeping 3mm copper clearance from all sides. Can somebody tell me what leads to this issue and what are possible solutions to this problem ?
In order to reduce the size of a PCB, I will probably have to use smaller SM components. I currently use mostly 0805 passives, and am thinking about going to 0402 or smaller. Apart from power dissipation considerations, any pitfalls I should be aware of when making the transition?
There is a copper pour over the entire top of the my PCB, which is part of GND net. It turns out that the surface mounted 1W LEDs I’m going to use have the heat slug connected internally to the LED’s +ve terminal. Can I rely on the solder mask to insulate the +ve voltage (~3V ish) from GND? Long term?
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