You can refer to the following table.
| Ball Dia. | Reduction | Land Pattern Density Level | Land Dia. | Land Variation |
| 0.15 | 15% | C | 0.13 | 0.15-0.10 |
| 0.20 | 15% | C | 0.17 | 0.20-0.14 |
| 0.25 | 20% | B | 0.20 | 0.20-0.17 |
| 0.30 | 20% | B | 0.25 | 0.25-0.20 |
| 0.35 | 20% | B | 0.30 | 0.35-0.25 |
| 0.55 | 25% | A | 0.40 | 0.45-0.35 |
Read More: BGA PCB Assembly
#PCB Design
I am designing a 2 layer PCB with components on both side of it. SMT components are one one side of PCB, but TH (through hole) components are on both sides. I need to understanding something mentioned by the supplier called primary and secondary sides.
I want to DIY PCB board at home, but raw material is limited. Can I hot glue to cover a PCB board? Is it advisable to do that?
On a Flex Printed Circuit (FPC) made out of Kapton polyimide, will anything bad happen if I put a VIA in a part of the FPC that has to bend? VIA size: 0.2 mm hole diameter in 0.4 mm copper diameter. FPC bend radius: 0.7 mm. Kapton thickness: 0.2 mm. Copper weight: either 2 oz or 1 oz (I haven’t decided yet)
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