Solder paste is composed of metal micro balls and flux. The metal doesn’t change over time much, but the flux does. Any solvent that maintains flux viscosity can ‘dry up’ over time and the total mixture becomes less viscous. This is a problem in a manufacturing environment because it can lead to improper flux distribution along a footprint during the stenciling process (especially if the flux balls up or has an affinity for itself more than what it is being dispensed onto).
This is mostly a problem in large PCB assembly lines.
#Assemblée PCB
BGA reballing emerges as a critical repair technique for modern electronic devices. Aujourd'hui, appareils électroniques…
Do you know what PCB stiffeners are? They are widely used in flex and rigid-flex…
Dans le processus de fabrication des PCB, PCB warpage is a common problem that manufacturers would encounter.…
In the world of printed circuit board design and manufacturing, precision and accuracy are paramount.…
Soldering is a cornerstone technique in electronics assembly, it's used to connect electrical pieces and…
Aujourd'hui, electronic products are both compact and lightweight while performing a variety of functions. Ce…