Customize Consent Preferences

We use cookies to help you navigate efficiently and perform certain functions. You will find detailed information about all cookies under each consent category below.

The cookies that are categorized as "Necessary" are stored on your browser as they are essential for enabling the basic functionalities of the site. ... 

Always Active

Necessary cookies are required to enable the basic features of this site, such as providing secure log-in or adjusting your consent preferences. These cookies do not store any personally identifiable data.

No cookies to display.

Functional cookies help perform certain functionalities like sharing the content of the website on social media platforms, collecting feedback, and other third-party features.

No cookies to display.

Analytical cookies are used to understand how visitors interact with the website. These cookies help provide information on metrics such as the number of visitors, bounce rate, traffic source, etc.

No cookies to display.

Performance cookies are used to understand and analyze the key performance indexes of the website which helps in delivering a better user experience for the visitors.

No cookies to display.

Advertisement cookies are used to provide visitors with customized advertisements based on the pages you visited previously and to analyze the effectiveness of the ad campaigns.

No cookies to display.

Comment gérer la ligne d'alimentation d'un PCB Bluetooth connecté à une antenne à puce de 2,4 GHz?

I'm making a 4 layer PCB prototype that uses a bluetooth mcu connected to a 2.4GHz chip antenna. I'm thinking about what to do with the feedline, whether it should be buried on one of the middle layers, or left on the top layer. To get a 50 ligne d'ohms, should I choose top layer with 13-mil width or buried miccrostrip with 7-mild width?

If the space required is too much, a top-layer microstrip is probably better than a buried one. Using a thinner dielectric layer to allow you to reduce the trace width, rather than burying the microstrip.

One scenario where the buried microstrip (or stripline) would be better if the board were used where there are conductive materials (like the lid of the enclosure) close enough to the board to disturb the impedance of a top-layer microstrip.

There are advantages to a wider microstrip line:

  1. It can handle higher power (not likely an issue for Bluetooth).
  2. It have better impedance control due to etching errors being smaller relative to the trace width.

The trade-off is of course the board area used. You need to consider not just the trace width, but also the desire for 3-5 trace widths of clearance around the trace to maintain controlled impedance.

Lire la suite: Fabrication de produits électroniques IoT

#Assemblage de PCB #Conception de PCB

Photo de Olivier Smith

Olivier Smith

Oliver est un ingénieur en électronique expérimenté, spécialisé dans la conception de PCB., circuits analogiques, systèmes embarqués, et prototypage. Ses connaissances approfondies couvrent la capture schématique, codage du micrologiciel, simulation, disposition, essai, et dépannage. Oliver excelle dans l'art de faire passer des projets du concept à la production de masse en utilisant ses talents de concepteur électrique et ses aptitudes en mécanique..
Photo de Olivier Smith

Olivier Smith

Oliver est un ingénieur en électronique expérimenté, spécialisé dans la conception de PCB., circuits analogiques, systèmes embarqués, et prototypage. Ses connaissances approfondies couvrent la capture schématique, codage du micrologiciel, simulation, disposition, essai, et dépannage. Oliver excelle dans l'art de faire passer des projets du concept à la production de masse en utilisant ses talents de concepteur électrique et ses aptitudes en mécanique..

Ce que les autres demandent

Où se trouve la terre dans un PCB?

J'apprends à concevoir une carte multicouche pour un dispositif médical, et j'ai une question sur l'endroit où le sol doit être placé.

Lisez les conseils détaillés des articles de blog