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BGA stands for Ball Grid Array. It is a style of component footprint. These footprints appear as a rectangular array of small circles – one where each “ball” of the component is attached.
There will generally be a rectangular outline around the array that corresponds to the edges of the component’s package, and probably also some silkscreen (written) information identifying the component.
Lire la suite: BGA PCB Assembly
#Assemblée PCB
Mon clavier mécanique est tout neuf donc je ne trouve pas où se trouve le coupable. Comment réparer la clé?
Sur un circuit imprimé flexible (FPC) en polyimide Kapton, Est-ce que quelque chose de grave arrivera si je mets un VIA dans une partie du FPC qui doit se plier? Taille VIA: 0.2 mm diamètre du trou po 0.4 mm diamètre du cuivre. Rayon de courbure FPC: 0.7 mm. Épaisseur du Kapton: 0.2 mm. Poids du cuivre: soit 2 onces ou 1 oz (Je n'ai pas encore décidé)
Nous prévoyons de visiter l'usine la semaine prochaine. Pourrions-nous en savoir plus sur le nombre de tests de base des PCB dans le domaine EMS?
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