Comment fonctionne le PCB avec la fonctionnalité 10M04SCU169C8G?

Lorsque vous choisissez une puce pour PCB d'Intel MAX 10 Famille, 10M04SCU169C8G peut attirer votre attention. Comme prévu, il est fondamentalement bon en termes d'adaptabilité à la température commerciale et de conformité RoHS6. en outre, four characteristics distinguish itself from its family and receive more attention from PCB designers.

Complete Signal Transmission of PCB Attributes to UBGA with 0.8mm-Ball-Pitch

Ébrécher: 10M04SCU169C8G	→	PCB Containing It
Ultra Fine Line BGA with 0.8mm ball pitch	→	Complete signal transmission

UBGA ball spacing usually comes in a variety of specifications, depending on application requirements and process technology. Common ball spacing specifications are 0.8mm, 1.0mm, 1.27mm, and 1.5mm. En particulier, the 0.8mm ball pitch provides better signal transmission performance and better reliability.

Excellent signal integrity: Smaller ball spacing reduces the signal transmission path, resulting in lower signal latency and improved signal integrity. This is essential for high-speed digital signal transmission and improves system performance and stability of the PCB.
Fiabilité: Smaller ball spacing provides greater structural strength for each ball because each connected ball is shared with such more material support that they will be stabler.

Energy Conservation of PCB Attributes to Single Supply of 10M04SCU169C8G

Ébrécher: 10M04SCU169C8G	→	PCB Containing It
Single Supply	→	Energy Conservation

Single power supply: The chip requires only one power supply, usually a DC power supply, to support daily operation. This characteristic allows more energy saving for a PCB. Due to the low power consumption of single supply, it can operate at lower energy consumption, while it also extend lifespan of PCB battery.

High Density of PCB Attributes to Compact 10M04SCU169C8G

Ébrécher: 10M04SCU169C8G	→	PCB Containing It
Compact Features	→	High Density Design

The small size and compact structure of 10M04SCU169C8G make it easy to Assemblée into PCB. It typically allows high density trace layout and components during Conception de PCB.

PCB with this compact chip plays an irreplaceable role in the field of high-tech fine product, such as embedded control systems, micro-controllers, micro-processors, smart sensors, and portable devices.

Data Storage Stability of PCB Attributes to 10M04SCU169C8G’s Flash Memory

Ébrécher: 10M04SCU169C8G	→	PCB Containing It
User Flash Memory	→	Good Data Storage Stability

Due to 1248Kb user flash memory, PCB with 10M04SCU169C8G of keeps data in storage in spite of power cut or device restart.

This type of PCB is usually applied in saving data and system software, such as solid state drives, téléphones portables, cameras and other electronic devices. en plus，it engages in some new field. Par exemple, it helps a series of complex algorithm of artificial intelligent device. Également, it takes charge of data storage in some IoT device.

Emporter

The above characteristic of 10M04SCU169C8G contributes to the professional function of PCB especially in some specific field. If you choose it and use it in proper field, it certainly brings surprising effect of your products, gaining customer belief against your product brand.

Will Li

Will maîtrise les composants électroniques, Processus de production de PCB et technologie d'assemblage, et possède une vaste expérience dans la supervision de la production et le contrôle de la qualité. Sur le principe d'assurer la qualité, Will fournit aux clients les solutions de production les plus efficaces.