Asamblea de PCB

¿Para qué sirven los relieves térmicos en las vías para un vertido de cobre??

  1. Easier routing and fan-out of BGAs and other dense parts. Particularly when putting planes under the BGA.
  2. Greater heat transfer to the planes on the PCB. You see this the most on QFNs and other packages with a ground pad on the bottom of the part in the center. This pad is intended to transfer heat to vias and then to the ground plane.
  3. There is less chance for the via to get messed up due to plating, drill accuracy issues, or other PCB manufacturing problems (not a huge benefit, but a benefit nonetheless).

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Oliver Smith

Oliver es un ingeniero electrónico experimentado y experto en diseño de PCB., circuitos analogicos, sistemas embebidos, y prototipos. Su profundo conocimiento abarca la captura esquemática, codificación de firmware, simulación, diseño, pruebas, y solución de problemas. Oliver se destaca en llevar proyectos desde el concepto hasta la producción en masa utilizando su talento en diseño eléctrico y su aptitud mecánica..

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