(miven the soldering process is under the suggested temperature.)
1.Component’s lead temperature is too cold and cannot form a good solder join.
2.Through-Hole Dimensions on the PCB are insufficient (too small)
3.Physical damage to the solder joint after soldering
Después de soldar, some processes may cause physical stress and fracturing, such as installing a heat sink on the surface, or installing unfitted plastic case molding.
Lee mas: Componentes de orificio pasante: La tecnología vintage sigue siendo clave en los PCB
#PCB Assembly #THT PCB Assembly #Manufacturing
In the world of printed circuit board design and manufacturing, precision and accuracy are paramount.…
Soldering is a cornerstone technique in electronics assembly, it's used to connect electrical pieces and…
Hoy en día, electronic products are both compact and lightweight while performing a variety of functions. Esta…
As technology continues to advance in the electronics industry, packaging remains one of the key…
Bringing your electronic ideas to life begins with PCB drawing, which is the process of…
Printed Circuit Board design is one of the most significant processes in electronics production. Deciding…