Asamblea de PCB

¿Cómo evitan los fabricantes de PCB que la soldadura entre en las vías durante la soldadura por ola??

Choose the right flux. There are many reasons for welding balls, but flux is the main reason.

Generalmente hablando, fluxes with low solid content tend to form solder balls when the underside SMD elements require double PCBA wave soldering. Because these additives are not designed to be used for long periods of time. If the flux sprayed on the PCB has been used up after the first wave crest, there is no flux after two peaks. Así, it cannot play the function of flux and help reduce tin balls.

One of the main ways to reduce the number of welding balls is to choose a flux that can withstand longer periods of heat.

Lee mas: Dominar la soldadura selectiva: Una guía completa

#Asamblea de PCB

Oliver Smith

Oliver es un ingeniero electrónico experimentado y experto en diseño de PCB., circuitos analogicos, sistemas embebidos, y prototipos. Su profundo conocimiento abarca la captura esquemática, codificación de firmware, simulación, diseño, pruebas, y solución de problemas. Oliver se destaca en llevar proyectos desde el concepto hasta la producción en masa utilizando su talento en diseño eléctrico y su aptitud mecánica..

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