Choose the right flux. There are many reasons for welding balls, but flux is the main reason.
Generalmente hablando, fluxes with low solid content tend to form solder balls when the underside SMD elements require double PCBA wave soldering. Because these additives are not designed to be used for long periods of time. If the flux sprayed on the PCB has been used up after the first wave crest, there is no flux after two peaks. Así, it cannot play the function of flux and help reduce tin balls.
One of the main ways to reduce the number of welding balls is to choose a flux that can withstand longer periods of heat.
Lee mas: Dominar la soldadura selectiva: Una guía completa
#Asamblea de PCB
BGA reballing emerges as a critical repair technique for modern electronic devices. Hoy en día, dispositivos electrónicos…
Do you know what PCB stiffeners are? They are widely used in flex and rigid-flex…
En el proceso de fabricación de PCB, PCB warpage is a common problem that manufacturers would encounter.…
In the world of printed circuit board design and manufacturing, precision and accuracy are paramount.…
Soldering is a cornerstone technique in electronics assembly, it's used to connect electrical pieces and…
Hoy en día, electronic products are both compact and lightweight while performing a variety of functions. Esta…