¿Se pueden soldar por reflujo los chips BGA con plomo mediante un proceso sin plomo??

Opción 1: Talk to your assembler and see if you could use two different temperature processes.

• Do the Lead-free profile first (that goes to a higher temperature)
• Luego, after those parts are done, solder the leaded parts on with a leaded temperature profile.

This satisfies the requirements of both. (you don’t need to worry about stenciling as BGA’s have solder balls)

Option 2

Install lead-free BGA’s with an IR rework station (which also supports temperature profiles). It is more difficult but possible.

Lee mas: Comprensión de los diferentes tipos de paquetes BGA

#Asamblea de PCB