Diseño de PCB

¿Puedo diseñar elementos SMD en la parte posterior de THT??

If you want to meet CE requirements for noise immunity and emissions, a two-layer board would help a lot.

Generalmente hablando, there is no problem with putting components on both sides of the board, in the same place. If you had a two (or more) layer board, you’d probably want to put a ground or power plane between them. sin embargo, you can’t do that with a single-layer board. So you should watch out for a fast digital chip interfering with an analog circuit. It would be inadvisable.

Por ejemplo, put a microcontroller on one side and a high input impedance buffer on the other. But putting decoupling caps opposite the chip is probably a good plan.

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Oliver Smith

Oliver es un ingeniero electrónico experimentado y experto en diseño de PCB., circuitos analogicos, sistemas embebidos, y prototipos. Su profundo conocimiento abarca la captura esquemática, codificación de firmware, simulación, diseño, pruebas, y solución de problemas. Oliver se destaca en llevar proyectos desde el concepto hasta la producción en masa utilizando su talento en diseño eléctrico y su aptitud mecánica..

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