(E.ven the soldering process is under the suggested temperature.)
1.Component’s lead temperature is too cold and cannot form a good solder join.
2.Through-Hole Dimensions on the PCB are insufficient (too small)
3.Physical damage to the solder joint after soldering
Nach dem Löten, some processes may cause physical stress and fracturing, such as installing a heat sink on the surface, or installing unfitted plastic case molding.
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