The soldering process for each side of the PCB is the same.
In der Regel, the surface tension will be enough to hold a BGA in place, given the number of balls compared to the weight of the chip. If it is not the components will be glued, but it is quite rare to need to do it.
By design, one should avoid putting heavy components on each side of the board. On the bottom, there should only be small components.
Weiterlesen: Sollte ich eine Doppelschichtplatine oder eine Einzelschichtplatine verwenden??
#Leiterplattenbestückung #PCB-Design
BGA reballing emerges as a critical repair technique for modern electronic devices. Heutzutage, elektronische Geräte…
Do you know what PCB stiffeners are? They are widely used in flex and rigid-flex…
Im PCB-Herstellungsprozess, PCB warpage is a common problem that manufacturers would encounter.…
In the world of printed circuit board design and manufacturing, precision and accuracy are paramount.…
Soldering is a cornerstone technique in electronics assembly, it's used to connect electrical pieces and…
Heutzutage, electronic products are both compact and lightweight while performing a variety of functions. Diese…