The soldering process for each side of the PCB is the same.
In der Regel, the surface tension will be enough to hold a BGA in place, given the number of balls compared to the weight of the chip. If it is not the components will be glued, but it is quite rare to need to do it.
By design, one should avoid putting heavy components on each side of the board. On the bottom, there should only be small components.
Weiterlesen: Sollte ich eine Doppelschichtplatine oder eine Einzelschichtplatine verwenden??
#Leiterplattenbestückung #PCB-Design
It is important to learn how to clean a circuit board properly if you’re working…
When designing PCBs, selecting the appropriate type of holes for fasteners is crucial. And much…
PCB copper foil is one of the most critical materials in the printed circuit board…
Shenzhen, China - Februar 11, 2025 - MOKO-Technologie, a leading global electronics manufacturing service…
While most people focus on the components and copper traces that make up PCBs, there's…
The right type of PCB material can make or break the performance of your electronics project.…