BGA steht für Ball Grid Array. Es handelt sich um eine Art Komponenten-Footprint. These footprints appear as a rectangular array of small circles – one where each “ball” of the component is attached.
Im Allgemeinen wird das Array von einem rechteckigen Umriss umgeben sein, der den Kanten des Komponentenpakets entspricht, und wahrscheinlich auch etwas Siebdruck (geschrieben) Informationen zur Identifizierung der Komponente.
Weiterlesen: BGA-Leiterplattenbaugruppe
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