Können bleihaltige BGA-Chips mit einem bleifreien Verfahren reflowgelötet werden??

Möglichkeit 1: Talk to your assembler and see if you could use two different temperature processes.

• Do the Lead-free profile first (that goes to a higher temperature)
• Dann, after those parts are done, solder the leaded parts on with a leaded temperature profile.

This satisfies the requirements of both. (you don’t need to worry about stenciling as BGA’s have solder balls)

Öption 2

Install lead-free BGA’s with an IR rework station (which also supports temperature profiles). It is more difficult but possible.

Weiterlesen: Verschiedene Arten von BGA-Paketen verstehen

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