10cl006yu256c8g ist ein gängiger Chip, der in Leiterplatten eingesetzt wird, mit immer einer anderen Backup-Auswahl, 10cl006ye144c8g. Wie treffen wir also währenddessen eine Wahl zwischen 10cl006yu256c8g und 10cl006ye144c8g? Leiterplattenmontage? Let’s dive into the question in the following text.
Both 10cl006ye144c8g and 10cl006yu256c8g are branded Intel, under the same IC family. If you compare their specification, you will find that they are similar with few distinction.
10cl006yu256c8g | 10cl006ye144c8g | |
Member Code | 6272 Logikelemente | 6272 Logikelemente |
M9K Memory: Block | 30 | 30 |
M9K Memory: Capacity(Kb) | 270 | 270 |
18*18 multiplier | 15 | 15 |
PLL | 2 | 2 |
Clock | 20 | 20 |
Maximum I/O | 176 | 176 |
Maximum LVDS | 65 | 65 |
Core Voltage | Standard Voltage | Standard Voltage |
Package Type | UBGA | EQFP |
Package Code | UBGA 256 Stifte | EQFP 144 Stifte |
Operating Temperatures | 0~85 degree centigrade | 0~85 degree centigrade |
FPGA Fabric Speed Grade | 8 | 8 |
Beachtung | RoHS6 | RoHS6 |
Both of them are with 6272 logic elements and standard temperature resistance. Außerdem, they comply to RoHS6. jedoch, package type of 10cl006ye144c8g is EQFP with 144 Stifte, while 10cloogyu256c8g have 256 pins in UBGA package.
Full name of UBGA in the PCB is Universal Ball Grid Array package. It adopts a ball-grid array structure with an independent spherical solder joint for each pin. This effectively improve the reliability and stability of the connection.
EQFP is also a form of electronic component packaging, whose full name is Equal Flat Package. It has a smaller volume.
Due to the small gap among pins on 10cl006yu256c8g, building precise connection between board and chip is a vital thing during soldering in the process of PCBA. Außerdem, more support and fixture should be offered during PCBA, since the UBGA framework of 10cl006yu256c8g weighs more than the other.
In the process of assembling 10cl006ye144c8g, you need to attach more importance on the bend of pins. If pins are bend in an improper scale, informal contact towards bonding pad will occur. More seriously, it brings bad quality and public reputation on the products. zusätzlich, 10cl006ye144c8g is usually good at heat dissipation with a large heatsink area. Thus sufficient space should be leaved to it during PCB-Design und Montage.
Both PCBs with 10cl006ye144c8g and 10cl006yu256c8g are applied in many significant field.
Mehr und mehr, 10cl006ye144c8g is even applied in the field of aerospace, such as system of planes, Satelliten, missiles. The high-standard of reliability allows it make aircraft operation safely.
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