CEM-3 is lighter than FR4,the average weight is about 3.5KG/sqm. but now most of PCB manufacturers less use CEM-3 material to make PCB,almost use FR4 material.
Read More: FR4 PCB
#PCB Design #PCB Materials
CEM-3 is lighter than FR4,the average weight is about 3.5KG/sqm. but now most of PCB manufacturers less use CEM-3 material to make PCB,almost use FR4 material.
Read More: FR4 PCB
#PCB Design #PCB Materials
I ordered RF PCB design and prototype from my supplier . There are something like a hole, but it is not, on the ground surface. What is the purpose of making these holes? The PCB is inside of the E70 433NW14S LoRa module.
I know that using leaded process for lead-free BGA chips is not acceptable, because the solder balls of the BGA will not melt and the joint will be unreliable. But now BGA chip is only available in lead-free balls. is it ok to solder leaded BGA chips with a lead-free (thus, higher temperature) process?
I find that the all types of PCB samples from my suppliers have ground planes. It seems important and I want to know about its function.
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