Can we do wave solder the through hole parts without masking it?

We would like to do wave soldering for the through hole components. All through hole components are top side of PCB. Only test points, which require mask during process, are on the bottom side. So there is a extra labour cost at adding and removing the mask. Can we do wave solder the through hole parts without masking it?
  • You can ask the assembly house to put Kapton tape over the test pads if you’ve designed the PCB to make that easier.
  • You can get the board supplier to add peelable solder mask, but it will cost money.
  • You can just use the pogo pins on the solder-covered pads in most cases, maybe not for very low-level measurements, and even for those there are particularly aggressive pins available that have a drilling action.

#PCB Assembly

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Oliver Smith

Oliver is an experienced electronics engineer skilled in PCB design, analog circuits, embedded systems, and prototyping. His deep knowledge spans schematic capture, firmware coding, simulation, layout, testing, and troubleshooting. Oliver excels at taking projects from concept to mass production using his electrical design talents and mechanical aptitude.
Picture of Oliver Smith

Oliver Smith

Oliver is an experienced electronics engineer skilled in PCB design, analog circuits, embedded systems, and prototyping. His deep knowledge spans schematic capture, firmware coding, simulation, layout, testing, and troubleshooting. Oliver excels at taking projects from concept to mass production using his electrical design talents and mechanical aptitude.

What Others Are Asking

How do you hold SMD part in place while soldering?

I go through this every time I have PCBs I need to populate with SMD parts, and this has become more an issue as pin spacings have gotten tighter, and my hands have become less steady with age. How do you hold SMD part in place while soldering?

Is paste mask layer, both top and bottom layer, necessary for THT components?

I know the paste mask layer is also called the stencil layer. It’s only used for assembly. I want to know if the paste mask layer (both top and bottom layer) is necessary for through hole components. For SMD components I know the paste mask layer is required to solder the components. Is it necessary for through hole components?

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