Can I send PCB fab the components directly?

I have a batch of idle PCB component in my housework, thinking about sending them to factory as materials for PCBA order. Is it advisable?

Not recommend.

  • Quality control problem: The manufacturer cannot guarantee the quality of materials sent by you, and the responsibilities for the quality of those components are not clear. Communication between the three parties may also result in a high time cost.
  • Storage condition problem: Due to the large variety of materials supplied by customers, fab cannot provide the correct storage conditions for each component with few understanding of caution issues.
  • Cost: Customer-supplied components require customers to bear the costs of customs clearance, logistics, and other expenses.

If you must have a customer supply, pay attention to

  1. Punctual supply of materials to the manufacturer. Build a good corporation with the manufacturer about supply chain management.
  2. Control the quality of raw materials by yourself carefully.

Read More: Why A Company Needs An Incoming Quality Control Process

#PCB Assembly

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Oliver Smith

Oliver is an experienced electronics engineer skilled in PCB design, analog circuits, embedded systems, and prototyping. His deep knowledge spans schematic capture, firmware coding, simulation, layout, testing, and troubleshooting. Oliver excels at taking projects from concept to mass production using his electrical design talents and mechanical aptitude.
Picture of Oliver Smith

Oliver Smith

Oliver is an experienced electronics engineer skilled in PCB design, analog circuits, embedded systems, and prototyping. His deep knowledge spans schematic capture, firmware coding, simulation, layout, testing, and troubleshooting. Oliver excels at taking projects from concept to mass production using his electrical design talents and mechanical aptitude.

What Others Are Asking

Is paste mask layer, both top and bottom layer, necessary for THT components?

I know the paste mask layer is also called the stencil layer. It’s only used for assembly. I want to know if the paste mask layer (both top and bottom layer) is necessary for through hole components. For SMD components I know the paste mask layer is required to solder the components. Is it necessary for through hole components?

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