BGA Types:
µBGA, CTBGA, CABGA, CVBGA, VFBGA, LGA,etc
With rich experience and comprehensive expertise, MOKO can always provide customers with high-quality and reliable BGA PCB assembly service.
Our BGA assembly services cover a wide range, including BGA prototype development, BGA PCB assembly, BGA component removal, BGA replacement, BGA rework and reballing, BGA PCB assembly inspection, and so on. Leveraging our full-coverage services, we can help customers streamline the supply network and accelerate product development time.
To achieve the highest quality standards for BGA assembly, we use a variety of inspection methods throughout the process including optical inspection, mechanical inspection, and X-ray inspection. Among them, the inspection of BGA solder joints must use X-rays. X-rays can pass through the components to inspect the solder joints below them, so as to check the solder joint position, solder joint radius, and solder joint thickness.
Efficient Use of Space – BGA PCB layout allows us to efficiently use the available space, so we can mount more components and manufacture lighter devices.
Better Thermal Performance – For BGA, the heat generated by the components is transferred directly through the ball. In addition, the large contact area improves heat dissipation, which prevents overheating of components and ensures long life.
Higher Electrical Conductivity – The path between the die and the circuit board is short, which results in better electrical conductivity. Moreover, there is no through-hole on the board, the whole circuit board is covered with solder balls and other components, so vacant spaces are reduced.
Easy to Assemble And Manage – Compared to other PCB assembly techniques, BGA is easier to assemble and manage as the solder balls are used directly to solder the package to the board.
Less Damage to Leads – We use solid solder balls for manufacturing BGA leads. Hence, there is a lesser risk that they will get damaged during the operation.
Quality Assurance
We fully comply with the ISO quality management system and all processes meet the highest quality standards for BGA PCB assembly.
Strong Assembly Capacities
MOKO is capable of handling almost all types of BGA, assembling BGA components from small to large sizes, including fine pitch BGA.
In-depth Expertise
We have a BGA assembly team composed of professional engineers and IPC-trained employees, providing technical support throughout the process to ensure high reliability.
BGA assembly is basically the process of mounting ball grid array on PCB through solder reflow method.
BGA is short for Ball Grid Array. A type of high density electronic component packaging used for integrated circuits.
The major benefits of ball grid array BGA include: improved electrical and thermal performance, denser packing, as well as enhanced interconnections.
BGA solder joints are usually inspected by X-ray inspection because the solder balls are located on the back side of the component and cannot be inspected with the naked eye.
Some of the common problems of BGA assembly include: misalignment, lack of solder joint, solder joint bridging and inadequate soldering.
Yes, BGAs can be reworked but this requires the use of special equipment and tools such as the rework station. By using this tool, we can remove the BGA component from the PCB without damaging it and replace the workable components.
We can handle different BGA packages such as MicroBGA, PBGA, CBGA, and TBGA to meet the needs of different projects.
MOKO Technology provides total BGA rework solution, such as BGA removal, BGA reballing and BGA reassembly.
The minimum BGA pitch size we can handle is 0.4mm.
MOKO Technology is certified to ISO 9001, ISO 13485 and IPC-A-610, and all BGA assembly operations are compliant to international quality and safety standards.