Technical Writer
Oliver is an experienced electronics engineer with over 7 years of experience developing products in IoT, consumer electronics, and medical devices. He is highly skilled in analog circuit design, embedded systems, PCB layout, firmware coding, and prototyping electronic products. Oliver’s expertise encompasses the full product development cycle, from concept to mass production. He holds a Master’s degree in Electrical Engineering and leverages his deep technical knowledge to deliver innovative electronic solutions.
According to IPC-7351, the cathode should be on the left for a molded diode. However, when I use component wizard of my suppliers to create a diode, it places the cathode (K) on the right. Does it depend on the manufacturer? How does the assembly house know which way is correct?
Many assembly factories are asking for SMT jobs, while I think through hole would be a better option for a high voltage application. Before the high voltage project is started, we need to make a call on SMT or Through hole parts. Is there a study on this?
Suppose one is hand-assembling a board with many SMT components. Unlike THT, SMT components are often not labeled. How might one keep small (<100) quantities of such parts properly organized during assembly? Are there particular tools? Storage devices? Methods?
I go through this every time I have PCBs I need to populate with SMD parts, and this has become more an issue as pin spacings have gotten tighter, and my hands have become less steady with age. How do you hold SMD part in place while soldering?
We are new brand of medical device. We are doing a device development recently. How can we find PCB schematics for reference?
I’m working on a project which requires the use of a CSP package. The product’s datasheet provides ball pitch and ball diameter but nothing about the preferred land pad diameter.
How can the pad diameter be worked out from these figures assuming an NSMD land?
I designed a PCB with an imaging sensor that is mechanically coupled to a lens assembly using four 2-56 screws. I’m noticing that even though the screws are holding the board tightly against the mechanical structure if I flick or lightly knock the the assembly the image “moves”. I’m hoping to get a few suggestions for ways to fix the PCB to the mechanical structure. Any suggestions for adhesives or the like? Something else?
We would like to do wave soldering for the through hole components. All through hole components are top side of PCB. Only test points, which require mask during process, are on the bottom side. So there is a extra labour cost at adding and removing the mask. Can we do wave solder the through hole parts without masking it?
I ordered RF PCB design and prototype from my supplier . There are something like a hole, but it is not, on the ground surface. What is the purpose of making these holes? The PCB is inside of the E70 433NW14S LoRa module.
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