Technical Writer
Oliver is an experienced electronics engineer with over 7 years of experience developing products in IoT, consumer electronics, and medical devices. He is highly skilled in analog circuit design, embedded systems, PCB layout, firmware coding, and prototyping electronic products. Oliver’s expertise encompasses the full product development cycle, from concept to mass production. He holds a Master’s degree in Electrical Engineering and leverages his deep technical knowledge to deliver innovative electronic solutions.
I’m making a 4 layer PCB prototype that uses a bluetooth mcu connected to a 2.4GHz chip antenna. I’m thinking about what to do with the feedline, whether it should be buried on one of the middle layers, or left on the top layer. To get a 50 ohm line, should I choose top layer with 13-mil width or buried miccrostrip with 7-mild width?
I want to implement a control system I designed for a light electric motorbike. I would like to mount it as professionally as possible on the chassis. It consists of a power system pcb and a SAMC21 development board which I’ll merge later once this all works properly. I have tried screwing it directly on the aluminium chassis but have found that shocks and vibrations from the horn disturbed the system or even destroyed it upon large shocks. Is there a specific way car and motorcycle manufacturers mount their electronics to make their system as robust as possible?
I am wondering if i ordered some aluminum pcbs that contain D2pak transistors and i want to solder a couple of them for testing is it possible using basic equipment or does it need an reflow soldering oven.
I know the paste mask layer is also called the stencil layer. It’s only used for assembly. I want to know if the paste mask layer (both top and bottom layer) is necessary for through hole components. For SMD components I know the paste mask layer is required to solder the components. Is it necessary for through hole components?
I have three through-hole PCBs that are missing front and back solder mask openings for two of the components. The solder mask (usually green) is covering the front and back solder pads. All other pads for all other parts are exposed. Is there a good way to remove the solder mask so that I can solder the components to the board?
I’m designing a PCB right now and found out I can save a lot of space using the back of THT elements. Is it legit to design like that? Are there any problems that might occur?
My EDA software (PCAD, but I guess others do this too) adds thermal reliefs on vias in a copper pour. What’s the use? Vias aren’t soldered.
I have a batch of PCBs with SMT nuts which has been assembled onto a PCB – the nut has kapton tape on top to allow easy pickup for assembly. How can we do this faster/what’s a better method?
I am designing a 2 layer PCB with components on both side of it. SMT components are one one side of PCB, but TH (through hole) components are on both sides. I need to understanding something mentioned by the supplier called primary and secondary sides.
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