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Technical Writer
Oliver is an experienced electronics engineer with over 7 years of experience developing products in IoT, consumer electronics, and medical devices. He is highly skilled in analog circuit design, embedded systems, PCB layout, firmware coding, and prototyping electronic products. Oliver’s expertise encompasses the full product development cycle, from concept to mass production. He holds a Master’s degree in Electrical Engineering and leverages his deep technical knowledge to deliver innovative electronic solutions.
I want to desolder a tiny surface mount button from the motherboard of a phone. There are a lot of similarly tiny components surrounding it that I do not want to damage with heat from the soldering iron. Can I use aluminium foil in lieu of kapton tape to protect these components?
In the design of a power electronic PCB, I want to use a metal PCB for heat dissipation of a TO-220 package MOSFET. To do that I want to mount metal PCB on the MOSFET with the use of thermal paste and screw exactly like we do when we use heatsink for the same package. Should I leave the copper of PCB between MOSFET surface and dielectric of PCB or remove the copper surface and leave only the dielectric opening?
The PCB has a pulse oximeter mounted on the surface, and it’s tolerance is 0.6mm. The problem is the pulse oximeter needs to touch the bottom case at all times. How to best mount the PCB in the case without putting too much stress on the pulse oximeter? Will screws with flexible washers be all right? Sadly separating pulse oximeter from main PCB is not an option.
I am designing a board that needs a couple linear regulators (5.5v to 3v and 3v to 1.6v) but I am having difficulty selecting a suitable surface mount package type and size that will allow me to hand solder the IC to the PCB without too much difficulty.
I’m designing a new PCB where I have a whack of connectors that have to line up with the metalwork. There are some problematic connectors. All 4 pins are round. I want to have the holes as small as possible while allowing for good solder adhesion over the full length of the pin. I’m looking for guidance on how much clearance around the component lead I should have in order to get good solder wetting and adhesion.
We found that edge-mounting a TO-Can package to a PCB will really save a lot on manufacturing. However, it comes with fairly long through-hole pins that are taking up too much space to reach the pads. Any suggestion?
My small PCB is mounting a very sensitive fragile sensor on the top surface that has to be wire bonded to the PCB, so I am trying to design a smaller PCB that can be surface mounted to the bigger PCB. How can I get some kind of thin footprint for interconnecting the two PCB boards?
I am prototyping a PCB, using Chip Quik’s “SMDSWLF.031, a Sn96.5/ Ag3.0/ Cu0.5 solder with 2.2% no-clean flux. I find that the black spots appears frequently in larger pads on my board. I wonder if it is because I left the soldering iron more time heating the solder and that burnt the flux. What is that black residue? Is that a sign of a bad joint or maybe bad soldering technique?
I’d like to use a processor that uses a pin grid array. Basically, I’d like to make the prototyping PCB board for it. I’m new to eagle. How can I connect the inner PGA pins to the header pins on the edge (without shorting the lines)?
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