Technical Writer
Oliver is an experienced electronics engineer with over 7 years of experience developing products in IoT, consumer electronics, and medical devices. He is highly skilled in analog circuit design, embedded systems, PCB layout, firmware coding, and prototyping electronic products. Oliver’s expertise encompasses the full product development cycle, from concept to mass production. He holds a Master’s degree in Electrical Engineering and leverages his deep technical knowledge to deliver innovative electronic solutions.
I am designing a micro-strip antenna with an HFSS toll, what’s the thickness of FR4 substrate that one should take ?
The power electronic converter is for high power application. I am going to design it for a new project. Any useful advice?
When I sourcing PCB online, I found some of them are with heavy copper. Why would the designer use copper for PCB?
A design engineer told me our PCB prototypes would be completed soon and then he would have his assembler “run a panel”. Does anyone know what that means?
I need to add a resistor into a data line on my project. The data line is a trace and carries low speed data. A through-hole resistor will be fine. The pins for both ends of the trace are exposed, but how do I add the resistor and remove the trace?
Although the adsorption of moisture by FR4 is quite low, what is the best way to minimize it or eliminate it completely?
While bored recently, I decided to take apart a few old pieces of electronic equipment and attempt to reverse-engineer them. I’ve been doing pretty well, but I’ve come to an IC that I can identify but doesn’t seem to exist on the manufacturer’s website.
On a Flex Printed Circuit (FPC) made out of Kapton polyimide, will anything bad happen if I put a VIA in a part of the FPC that has to bend? VIA size: 0.2 mm hole diameter in 0.4 mm copper diameter. FPC bend radius: 0.7 mm. Kapton thickness: 0.2 mm. Copper weight: either 2 oz or 1 oz (I haven’t decided yet)
I am designing a PCB with 1088 pin BGA IC. Haven’t handle such a big IC. I am not sure the best amount of layer.
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