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The soldering process for each side of the PCB is the same.
Usually, the surface tension will be enough to hold a BGA in place, given the number of balls compared to the weight of the chip. If it is not the components will be glued, but it is quite rare to need to do it.
By design, one should avoid putting heavy components on each side of the board. On the bottom, there should only be small components.
Read More: Should I Use Double Layer PCB or Single Layer PCB?
#PCB Assembly #PCB Design
After We have assembled the Virtex-4 FPGA BGA package on our custom design PCB, we check for short circuits between all power grounding and they shows short cut between each other. Please tell us about any process for debugging this issue.
My EDA software (PCAD, but I guess others do this too) adds thermal reliefs on vias in a copper pour. What’s the use? Vias aren’t soldered.
There is a copper pour over the entire top of the my PCB, which is part of GND net. It turns out that the surface mounted 1W LEDs I’m going to use have the heat slug connected internally to the LED’s +ve terminal. Can I rely on the solder mask to insulate the +ve voltage (~3V ish) from GND? Long term?
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