BGA stands for Ball Grid Array. It is a style of component footprint. These footprints appear as a rectangular array of small circles – one where each “ball” of the component is attached.
There will generally be a rectangular outline around the array that corresponds to the edges of the component’s package, and probably also some silkscreen (written) information identifying the component.
Read More: BGA PCB Assembly
#PCB Assembly
I am thinking which type of light dependent resistor photoresistor LDR is better. gl5516 or 5506 sensor? Can anyone brief the main difference?
After making efforts in a period, I finally finish my PCB design. Next step is releasing them to factory for production. To be honest, I don’t want any mistake on my file which may interrupt further prodution process. So what points should I pay attention when I double-check my design?
I receive the samples BOM of our PCBA factory. It remarks that PCB is FR4 Isola 370HR. What is this and is it reliable materials?
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