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Based in Shenzhen, Shenzhen MOKO specialize in electronic design, PCB manufacture, PCB assembly, and component sourcing services, also could provide:
- PCB&PCBA Contract Manufacturing
- Reverse Engineering Services
- PCB Design and Assembly
- Component Procurement & Material Management
- Product Design
- Fast PCB&PCBA Prototyping
- Cable and Wire Assemblies
- Plastics and Molds
- AOI,X-Ray Testing, other Function Testing Service
1.Bare Printed Circuit Board process capability:
|1||Layers||Single Sided,2 to 18 Layer|
|2||Board material type||FR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg, Rogers and more|
|3||Compound material lamination||4 to 6 layers|
|4||Maximum dimension||610 x 1,100mm|
|6||Board thickness coverage||0.2 to 6.00mm|
|7||Board thickness tolerance||±10%|
|8||DK thickness||0.076 to 6.00mm|
|9||Minimum line width||0.10mm|
|10||Minimum line space||0.10mm|
|11||Outer layer copper thickness||8.75 to 175µm|
|12||Inner layer copper thickness||17.5 to 175µm|
|13||Drilling hole diameter (mechanical drill)||0.25 to 6.00mm|
|14||Finished hole diameter (mechanical drill)||0.20 to 6.00mm|
|15||Hole diameter tolerance (mechanical drill)||0.05mm|
|16||Hole position tolerance (mechanical drill)||0.075mm|
|17||Laser drill hole size||0.10mm|
|18||Board thickness and hole diameter ratio||10:1|
|19||Solder mask type||Green, Yellow, Black, Purple, Blue, White and Red|
|20||Minimum solder mask||Ø0.10mm|
|21||Minimum size of solder mask separation ring||0.05mm|
|22||Solder mask oil plug hole diameter||0.25 to 0.60mm|
|23||Impedance control tolerance||±10%|
|24||Surface finish||Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger|
♦ All of the above description is to demonstrate the ability of our factory, if you have specific requirements, please contact us.
2.PCB (PCB Assembly) rocess capability:
|Technical Requirement||Professional Surface-mounting and Through-hole soldering Technology|
|Various sizes like 1206,0805,0603 components SMT technology|
|ICT(In Circuit Test),FCT(Functional Circuit Test) technology|
|PCB Assembly With UL,CE,FCC,Rohs Approval|
|Nitrogen gas reflow soldering technology for SMT|
|High Standard SMT&Solder Assembly Line|
|High density interconnected board placement technology capacity|
|Quote&Production Requirement||Gerber File or PCB File for Bare PCB Board Fabrication|
|Bom(Bill of Material) for Assembly,PNP(Pick and Place file) and Components Position also needed in assembly|
|To reduce the quote time, please provide us the full part number for each components,Quantity per board also the quantity for orders.|
|Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate|
|OEM/ODM/EMS Services||PCBA, PCB assembly: SMT & PTH & BGA|
|PCBA and enclosure design|
|Components sourcing and purchasing|
|Plastic injection molding|
|Metal sheet stamping|
|Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)|
|Custom clearance for material importing and product exporting|
|Other PCB Assembly Equipments||SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4|
|Reflow Oven: FolunGwin FL-RX860|
|Wave Soldering Machine: FolunGwin ADS300|
|Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing Service|
Fully Automatic SMT Stencil Printer: FolunGwin Win-5
MOKO Technology Limited
Address：4F,Buidling2,Guanghui Technology Park,MinQing Rd,Longhua,SZ 518109,China