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BGA Assembly Services, Ball Grid Assembly Services
- Introduction：MOKO works with BGA (Ball Grid Array) assembly services and one stop destination for all your BGA assembly services, we has been providing BGA assembly, BGA rework and BGA Reballing services in EMS industry for over 10 years. With state-of-the-art BGA placement equipment, correct BGA assembly processes and X-ray test equipment, you can rely on us to build high quality and good yield rate BGA boards.
The Premier Destination for BGA Assembly Services In ChinaWhen MOKO PCB Assembly starting doing BGA assembly on year 2001, there is not many company play with this new technology yet.
MOKO Technology Latd has immense expertise and expericence in Ball Grid Array (BGA) assemblies. We provide BGA assembly services that are well-known among clients for producing quality circuit boards with precision component placement and soldering excellence.
BGA Assembly Service FeaturesWe offer the entire gamut of Assembly services for BGAs, including:
Ceramic BGA (CBGA)
Plastic BGA (PBGA)
Micro Fine Line BGA (MBGA)
Leaded and Lead free BGAs
We provide these with ultra-fine pitch quad flat packages (QFP), Quad Flat No Lead Package (QFN), and Chip Scale Packages (CSP). We analyze BGA data sheets, BGA size and ball material composition. We optimize the thermal profile of the BGAs to improve the quality of the assembly process.
We utilize the latest equipment in automated Surface Mount Technology (SMT) assembly to help us meet this goal:
Automated Placement Machines
Automatic Solder Dispensing Machine
X-ray and AOI Inspection Systems
Specialized Inspection Systems for solder ball height and coverage
An ESD and climate controlled environment is also utilized to ensure that the finished products meet all standards of efficiency, reliability, and quality.
Review and Rework Services
Apart from these, we can also provide rework and reballing services for BGAs that are already in use. Our rework and reballing capabilities include BGA removal and replacement, rework of ceramic and plastic BGAs and reballing of MBGAs. Our BGA rework process comprises:
Preparing the rework area
Solder paste application
Replacement of BGA
Reflow of circuit board
Our rework processes are guaranteed to protect the circuit board from any future damage.
Moko can even working with board which has 6 BGAs on top side and bottom side, that is not challenge enough, we also can work both Lead Free BGA and Leaded BGA at same circuit board.
MOKO Technology Ltd located in ShenZhen, China. Tel: 86-75523573370
Please send email for quote to email@example.com
MOKO Technology Limited
Address：4F,Buidling2,Guanghui Technology Park,MinQing Rd,Longhua,SZ 518109,China
* RequirePurchase：BGA Assembly Services, Ball Grid Assembly Services